Category:Suguru YAMAGISHI

Suguru YAMAGISHI

Executive Summary

Suguru YAMAGISHI is an inventor who has filed 4 patents. Their primary areas of innovation include PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), Use of materials for the substrate (1 patents), and they have worked with companies such as SUMITOMO ELECTRIC INDUSTRIES, LTD. (3 patents), Sumitomo Electric Industries, Ltd. (1 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H05K2201/09236 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H05K2201/09618 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H05K1/036 (Use of materials for the substrate): 1 patents
• H05K1/0237 ({using auxiliary mounted passive components or auxiliary substances (printed passive components): 1 patents
• H05K1/09 (Use of materials for the {conductive, e.g. } metallic pattern): 1 patents
• H05K2201/015 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/0154 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/0355 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/068 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/0228 ({Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs): 1 patents
• H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09636 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/0218 ({by printed shielding conductors, ground planes or power plane (): 1 patents
• H05K1/0298 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K3/0026 (Apparatus or processes for manufacturing printed circuits): 1 patents
• H05K3/4661 (Manufacturing multilayer circuits): 1 patents
• H05K2201/09227 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09545 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09609 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01Q9/0457 ({electromagnetically coupled to the feed line}): 1 patents

Companies

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List of Companies

• SUMITOMO ELECTRIC INDUSTRIES, LTD.: 3 patents
• Sumitomo Electric Industries, Ltd.: 1 patents

Collaborators

• Ichiro KUWAYAMA (4 collaborations)
• Hiroshi UEDA (3 collaborations)
• Shun IGARASHI (2 collaborations)
• Satoshi KIYA (2 collaborations)
• Toshiki IWASAKI (1 collaborations)
• Akihiro YANO (1 collaborations)
• Takuma YAMAMOTO (1 collaborations)
• Yusuke YAHATA (1 collaborations)
• Yutaro MIKI (1 collaborations)