Category:Ching-Wei Tsai

Ching-Wei Tsai

Executive Summary

Ching-Wei Tsai is an inventor who has filed 4 patents. Their primary areas of innovation include Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (2 patents), Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (4 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Ching-Wei Tsai Monthly Patent Applications.png

Technology Areas

File:Ching-Wei Tsai Top Technology Areas.png

List of Technology Areas

• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2225/06541 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 2 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13009 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29009 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08221 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1306 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 1 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06548 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5223 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5329 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D86/011 (No explanation available): 1 patents
• H10D86/215 (No explanation available): 1 patents
• G11C11/221 ({using ferroelectric capacitors}): 1 patents
• H01L21/7681 ({involving one or more buried masks}): 1 patents
• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H10D84/0193 (No explanation available): 1 patents
• H10D84/038 (No explanation available): 1 patents
• H10F39/811 (No explanation available): 1 patents
• H10F39/813 (No explanation available): 1 patents

Companies

File:Ching-Wei Tsai Top Companies.png

List of Companies

• Taiwan Semiconductor Manufacturing Co., Ltd.: 4 patents

Collaborators

• Chih-Chao Chou (3 collaborations)
• Cheng-Chi Chuang (2 collaborations)
• Shang-Wen Chang (2 collaborations)
• Chih-Hao Wang (1 collaborations)
• Yi-Hsun Chiu (1 collaborations)
• Yu-Xuan Huang (1 collaborations)
• Hou-Yu Chen (1 collaborations)
• Kuan-Lun Cheng (1 collaborations)
• Chung-Hui Chen (1 collaborations)