Category:Yumin Liu

Yumin Liu

Executive Summary

Yumin Liu is an inventor who has filed 2 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), consisting of soldered {or bonded} constructions {(bump connectors (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as Huawei Digital Power Technologies Co., Ltd. (2 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Yumin Liu Monthly Patent Applications.png

Technology Areas

File:Yumin Liu Top Technology Areas.png

List of Technology Areas

• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/488 (consisting of soldered {or bonded} constructions {(bump connectors): 1 patents
• H01L24/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L2224/24145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/1058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4882 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/3737 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• Huawei Digital Power Technologies Co., Ltd.: 2 patents

Collaborators

• Andreas MUNDING (2 collaborations)
• Lasse Petteri Palm (2 collaborations)