Category:Chen-Hua Yu

Chen-Hua Yu

Executive Summary

Chen-Hua Yu is an inventor who has filed 9 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), {Multilayer substrates ( (3 patents), {Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group (3 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (9 patents). Their most frequent collaborators include (5 collaborations), (4 collaborations), (2 collaborations).

Patent Filing Activity

File:Chen-Hua Yu Monthly Patent Applications.png

Technology Areas

File:Chen-Hua Yu Top Technology Areas.png

List of Technology Areas

• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/5383 ({Multilayer substrates (): 3 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 3 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 2 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 2 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3675 (Cooling facilitated by shape of device {(): 2 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• G02B6/12004 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/12 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/1228 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/13 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B6/4202 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4274 (Coupling light guides with opto-electronic elements): 1 patents
• H01L21/7684 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16055 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16112 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16148 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/19033 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/4214 (Coupling light guides with opto-electronic elements): 1 patents
• H01L21/266 (using masks {(): 1 patents
• H01L21/76254 (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
• H01L27/0688 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/3185 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/53228 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/0271 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/0298 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01L2224/02373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/52 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/563 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/4006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2023/4031 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2023/405 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2023/4087 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 9 patents

Collaborators

• Chung-Shi Liu (5 collaborations)
• Hao-Yi Tsai (4 collaborations)
• Chung-Hao Tsai (2 collaborations)
• Chung-Ming Weng (2 collaborations)
• Cheng-Chieh Hsieh (2 collaborations)
• Hung-Yi Kuo (2 collaborations)
• Tsung-Yuan Yu (2 collaborations)
• Hua-Kuei Lin (2 collaborations)
• Tin-Hao Kuo (2 collaborations)
• Chih-Chieh Chang (1 collaborations)
• Chuei-Tang Wang (1 collaborations)
• Hsiu-Jen Lin (1 collaborations)
• Ming-Che Ho (1 collaborations)
• Yu-Hsiang Hu (1 collaborations)
• Chewn-Pu Jou (1 collaborations)
• Cheng-Tse Tang (1 collaborations)
• Che-Hsiang Hsu (1 collaborations)
• Su-Chun Yang (1 collaborations)
• Jui Hsuan Tsai (1 collaborations)
• Jih-Churng Twu (1 collaborations)
• Ching-Ho CHIN (1 collaborations)
• Chuei-Tang WANG (1 collaborations)
• Kuo-Chung Yee (1 collaborations)
• Yu-Chia Lai (1 collaborations)
• Po-Yuan Teng (1 collaborations)
• Wei-Chih Lai (1 collaborations)
• Chien-Chia Chiu (1 collaborations)
• Der-Chyang Yeh (1 collaborations)
• Cheng-Hsien Hsieh (1 collaborations)
• Li-Han Hsu (1 collaborations)
• Tsung-Shu Lin (1 collaborations)
• Wei-Cheng Wu (1 collaborations)
• Yu-Chen Hsu (1 collaborations)