Category:Jee Heum PAIK
Jee Heum PAIK
Executive Summary
Jee Heum PAIK is an inventor who has filed 3 patents. Their primary areas of innovation include for stable pick-up of the scene, e.g. compensating for camera body vibrations (2 patents), {Conductive pattern lay-out details not covered by sub groups (1 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (1 patents), and they have worked with companies such as LG INNOTEK CO., LTD. (3 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (1 collaborations).
Patent Filing Activity
File:Jee Heum PAIK Monthly Patent Applications.png
Technology Areas
File:Jee Heum PAIK Top Technology Areas.png
List of Technology Areas
- H04N23/687 (for stable pick-up of the scene, e.g. compensating for camera body vibrations): 2 patents
- H05K1/0296 ({Conductive pattern lay-out details not covered by sub groups): 1 patents
- H05K1/116 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/0939 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/09618 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/10151 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H05K2201/10287 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- H10F39/804 (No explanation available): 1 patents
- H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
- G02B7/08 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
- H01F7/126 (MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES (ceramics based on ferrites): 1 patents
- H01F7/129 (MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES (ceramics based on ferrites): 1 patents
- H01F7/17 (MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES (ceramics based on ferrites): 1 patents
- H04N23/54 (PICTORIAL COMMUNICATION, e.g. TELEVISION): 1 patents
- H01L27/14636 ({Interconnect structures}): 1 patents
- H01L27/14625 ({Optical elements or arrangements associated with the device}): 1 patents
- H01L27/14634 ({Assemblies, i.e. Hybrid structures}): 1 patents
- H04N23/55 (PICTORIAL COMMUNICATION, e.g. TELEVISION): 1 patents
Companies
File:Jee Heum PAIK Top Companies.png
List of Companies
- LG INNOTEK CO., LTD.: 3 patents
Collaborators
- Hae Sik KIM (2 collaborations)
- Young Joon SON (2 collaborations)
- Jung Shik BAIK (1 collaborations)
- Eun Sung SEO (1 collaborations)
- Duck Hoon PARK (1 collaborations)
Subcategories
This category has the following 4 subcategories, out of 4 total.