Category:JHIH-WEI LAI

JHIH-WEI LAI

Executive Summary

JHIH-WEI LAI is an inventor who has filed 3 patents. Their primary areas of innovation include based on aluminium nitride (1 patents), {obtaining ceramic films, e.g. by using temporary supports} (1 patents), {Milling} (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

File:JHIH-WEI LAI Monthly Patent Applications.png

Technology Areas

File:JHIH-WEI LAI Top Technology Areas.png

List of Technology Areas

• C04B35/581 (based on aluminium nitride): 1 patents
• C04B35/62218 ({obtaining ceramic films, e.g. by using temporary supports}): 1 patents
• C04B35/6261 ({Milling}): 1 patents
• C04B35/638 (Removal thereof): 1 patents
• C04B35/64 (Burning or sintering processes (): 1 patents
• C04B2235/3225 (Yttrium oxide or oxide-forming salts thereof): 1 patents
• C04B2235/386 (Boron nitrides): 1 patents
• C04B2235/3865 (Aluminium nitrides): 1 patents
• C04B2235/528 (Spheres): 1 patents
• C04B2235/5292 (Flakes, platelets or plates): 1 patents
• C04B2235/5436 (micrometer sized, i.e. from 1 to 100 micron): 1 patents
• C04B2235/5445 (submicron sized, i.e. from 0,1 to 1 micron): 1 patents
• C04B2235/5454 (nanometer sized, i.e. below 100 nm): 1 patents
• C04B2235/6025 (Tape casting, e.g. with a doctor blade): 1 patents
• C04B2235/604 (Pressing at temperatures other than sintering temperatures): 1 patents
• C04B2235/612 (Machining): 1 patents
• C04B2235/6581 (Total pressure below 1 atmosphere, e.g. vacuum): 1 patents
• C04B2235/667 (Sintering using wave energy, e.g. microwave sintering): 1 patents
• C04B2235/668 (Pressureless sintering): 1 patents
• C04B2235/78 (Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures): 1 patents
• H05K3/12 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
• H05K1/18 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H05K2201/10984 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H10H20/857 (No explanation available): 1 patents
• H10H20/853 (No explanation available): 1 patents
• H10H20/0362 (No explanation available): 1 patents
• H10H20/0364 (No explanation available): 1 patents

Companies

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List of Companies

• TONG HSING ELECTRONIC INDUSTRIES, LTD.: 3 patents

Collaborators

• SHIH-HAN WU (3 collaborations)
• JIAN-YU SHIH (3 collaborations)
• MING-YEN PAN (2 collaborations)
• KAI-MOU CHOU (1 collaborations)
• YU-HSIEN LIAO (1 collaborations)
• HAO-EN HUNG (1 collaborations)