Category:Chih-Cheng LEE
Chih-Cheng LEE
Executive Summary
Chih-Cheng LEE is an inventor who has filed 2 patents. Their primary areas of innovation include {Apparatus for placing on an insulating substrate, e.g. tape} (1 patents), {Delaminating} (1 patents), {Via connections through the substrates, e.g. pins going through the substrate, coaxial cables ( (1 patents), and they have worked with companies such as Advanced Semiconductor Engineering, Inc. (2 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).
Patent Filing Activity
File:Chih-Cheng LEE Monthly Patent Applications.png
Technology Areas
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List of Technology Areas
- H01L21/67132 ({Apparatus for placing on an insulating substrate, e.g. tape}): 1 patents
- B32B43/006 ({Delaminating}): 1 patents
- H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 1 patents
- H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
- H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
- H01L23/3157 ({Partial encapsulation or coating (mask layer used as insulation layer): 1 patents
- H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
- H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
Companies
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List of Companies
- Advanced Semiconductor Engineering, Inc.: 2 patents
Collaborators
- Hsing Kuo TIEN (1 collaborations)
- Cheng-Lin HO (1 collaborations)