Jump to content

Category:Choongbin YIM

From WikiTrademarks

Choongbin YIM

Executive Summary

Choongbin YIM is an inventor who has filed 1 patents. Their primary areas of innovation include {Multilayer substrates ( (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as SAMSUNG ELECTRONICS CO.,LTD. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Choongbin YIM Monthly Patent Applications.png

Technology Areas

File:Choongbin YIM Top Technology Areas.png

List of Technology Areas

  • H01L23/5383 ({Multilayer substrates (): 1 patents
  • H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
  • H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
  • H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 1 patents
  • H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Choongbin YIM Top Companies.png

List of Companies

  • SAMSUNG ELECTRONICS CO.,LTD.: 1 patents

Collaborators

Subcategories

This category has the following 3 subcategories, out of 3 total.

C

J

Cookies help us deliver our services. By using our services, you agree to our use of cookies.