Category:Chung-Wei Wang

Chung-Wei Wang

Executive Summary

Chung-Wei Wang is an inventor who has filed 2 patents. Their primary areas of innovation include {Conductive pattern lay-out details not covered by sub groups (1 patents), {Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance ( (1 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (1 patents), and they have worked with companies such as Industrial Technology Research Institute (2 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Chung-Wei Wang Monthly Patent Applications.png

Technology Areas

File:Chung-Wei Wang Top Technology Areas.png

List of Technology Areas

• H05K1/0296 ({Conductive pattern lay-out details not covered by sub groups): 1 patents
• H05K1/0256 ({Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (): 1 patents
• H05K1/0271 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/0284 ({Details of three-dimensional rigid printed circuit boards (): 1 patents
• H05K2201/09045 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09118 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09236 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/141 (Structural association of two or more printed circuits (providing electric connection to or between printed circuits): 1 patents
• H05K1/117 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/045 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/08 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

Companies

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List of Companies

• Industrial Technology Research Institute: 2 patents

Collaborators

• Yi-Rong Lin (1 collaborations)
• Hsiao-Fen Wei (1 collaborations)
• Li-Wei Yao (1 collaborations)
• Chen-Tsai Yang (1 collaborations)
• Shu-Wei Kuo (1 collaborations)
• Min-Hsiung Liang (1 collaborations)
• Bor-Chuan Chuang (1 collaborations)