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Category:Daisuke IWATA

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Daisuke IWATA

Executive Summary

Daisuke IWATA is an inventor who has filed 1 patents. Their primary areas of innovation include with means connecting the layers, e.g. tie layers or undercuts (1 patents), {combined with shaping by orienting, stretching or shrinking, e.g. film blowing ( (1 patents), flexible, e.g. films (1 patents), and they have worked with companies such as TOYOBO CO., LTD. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Daisuke IWATA Monthly Patent Applications.png

Technology Areas

File:Daisuke IWATA Top Technology Areas.png

List of Technology Areas

  • B29C48/22 (with means connecting the layers, e.g. tie layers or undercuts): 1 patents
  • B29C48/0018 ({combined with shaping by orienting, stretching or shrinking, e.g. film blowing (): 1 patents
  • B29C48/08 (flexible, e.g. films): 1 patents
  • B29C48/154 (incorporating preformed parts or layers, e.g. extrusion moulding around inserts): 1 patents
  • B29K2023/06 (INDEXING SCHEME ASSOCIATED WITH SUBCLASSES): 1 patents
  • B29K2995/0012 (INDEXING SCHEME ASSOCIATED WITH SUBCLASSES): 1 patents
  • B29K2995/0053 (INDEXING SCHEME ASSOCIATED WITH SUBCLASSES): 1 patents
  • B29K2995/0067 (INDEXING SCHEME ASSOCIATED WITH SUBCLASSES): 1 patents
  • B29L2031/7128 (INDEXING SCHEME ASSOCIATED WITH SUBCLASS): 1 patents

Companies

File:Daisuke IWATA Top Companies.png

List of Companies

  • TOYOBO CO., LTD.: 1 patents

Collaborators

Subcategories

This category has the following 5 subcategories, out of 5 total.

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D

M

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Y

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