Category:Douglas Michael Reber of Austin TX (US)

Douglas Michael Reber of Austin TX (US)

Executive Summary

Douglas Michael Reber of Austin TX (US) is an inventor who has filed 4 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), {containing carbon, e.g. fullerenes (superconducting fullerenes (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as NXP USA, INC. (2 patents), NXP USA, Inc. (2 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/53276 ({containing carbon, e.g. fullerenes (superconducting fullerenes): 2 patents
• H01L29/7843 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/0217 ({the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz (): 1 patents
• H01L21/823807 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/76823 ({transforming an insulating layer into a conductive layer}): 1 patents
• H01L21/76826 ({by contacting the layer with gases, liquids or plasmas}): 1 patents
• H01L21/76828 ({thermal treatment}): 1 patents
• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L23/5329 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/76877 ({Thin films associated with contacts of capacitors}): 1 patents
• H01L21/76894 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L23/53238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05082 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05573 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13082 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• NXP USA, INC.: 2 patents
• NXP USA, Inc.: 2 patents

Collaborators

• Mehul D. Shroff of Austin TX (US) (2 collaborations)
• Ertugrul Demircan of Eugene OR (US) (2 collaborations)