Category:Francois Hebert of San Mateo CA (US)

Francois Hebert of San Mateo CA (US)

Executive Summary

Francois Hebert of San Mateo CA (US) is an inventor who has filed 8 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), and they have worked with companies such as GlobalFoundries U.S. Inc. (8 patents). Their most frequent collaborators include (4 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

File:Francois Hebert of San Mateo CA (US) Monthly Patent Applications.png

Technology Areas

File:Francois Hebert of San Mateo CA (US) Top Technology Areas.png

List of Technology Areas

• H01L29/1608 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L29/7813 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L29/66068 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L29/66734 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/049 (the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer): 1 patents
• H01L21/02057 ({Cleaning during device manufacture}): 1 patents
• H01L21/02164 ({the material being a silicon oxide, e.g. SiO): 1 patents
• H01L21/02178 ({the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz (): 1 patents
• H01L21/0228 ({deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD}): 1 patents
• H01L21/02337 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/063 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/0465 ({using ion implantation}): 1 patents
• H01L29/1095 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02244 ({the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides (adhesion layers or buffer layers): 1 patents
• H01L21/0332 (comprising inorganic layers): 1 patents
• H01L21/32053 (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers (manufacture of electrodes): 1 patents
• H01L29/4236 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/4238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66666 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7827 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/0883 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66462 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7786 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/402 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0607 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/808 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• GlobalFoundries U.S. Inc.: 8 patents

Collaborators

• James A. Cooper of Santa Fe NM (US) (4 collaborations)
• Hema Lata Rao Maddi of Columbus OH (US) (2 collaborations)
• Santosh Sharma of Austin TX (US) (1 collaborations)
• Jerry Joseph James (1 collaborations)
• Steven J. Bentley of Menands NY (US) (1 collaborations)
• Richard J. Rassel of Essex Junction VT (US) (1 collaborations)