Category:Hao-Chih HSIEH
Hao-Chih HSIEH
Executive Summary
Hao-Chih HSIEH is an inventor who has filed 2 patents. Their primary areas of innovation include {Geometry or} layout of the interconnection structure {( (1 patents), Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (1 patents), Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (1 patents), and they have worked with companies such as Advanced Semiconductor Engineering, Inc. (2 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).
Patent Filing Activity
File:Hao-Chih HSIEH Monthly Patent Applications.png
Technology Areas
File:Hao-Chih HSIEH Top Technology Areas.png
List of Technology Areas
- H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
- H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
- H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
- H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
- H01L25/165 (the devices being of types provided for in two or more different main groups of groups): 1 patents
- H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/19105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
- H01L23/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
- H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
- H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
- H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
- H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 1 patents
Companies
File:Hao-Chih HSIEH Top Companies.png
List of Companies
- Advanced Semiconductor Engineering, Inc.: 2 patents
Collaborators
- Chun-Kai CHANG (1 collaborations)
- Chao Wei LIU (1 collaborations)
- Tun-Ching PI (1 collaborations)
- Sung-Hung CHIANG (1 collaborations)
- Yu-Chang CHEN (1 collaborations)