Category:Hikaru MIURA

Hikaru MIURA

Executive Summary

Hikaru MIURA is an inventor who has filed 1 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating (1 patents), SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal (1 patents), and they have worked with companies such as SHINKAWA LTD. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H01L24/78 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• B23K20/005 (Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating): 1 patents
• B23K20/10 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L2224/78353 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• SHINKAWA LTD.: 1 patents

Collaborators

• Takuya ASAMI (1 collaborations)
• Yoshihiro MIYATA (1 collaborations)