Category:Hiroaki KAGEYAMA
Hiroaki KAGEYAMA
Executive Summary
Hiroaki KAGEYAMA is an inventor who has filed 2 patents. Their primary areas of innovation include {using temporarily an auxiliary support} (1 patents), {Delaminating} (1 patents), Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls (1 patents), and they have worked with companies such as Nichia Corporation (1 patents), NICHIA CORPORATION (1 patents). Their most frequent collaborators include .
Patent Filing Activity
File:Hiroaki KAGEYAMA Monthly Patent Applications.png
Technology Areas
File:Hiroaki KAGEYAMA Top Technology Areas.png
List of Technology Areas
- H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
- B32B43/006 ({Delaminating}): 1 patents
- H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
- B32B2310/0843 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
- B32B2457/00 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
- H01L2221/68354 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2221/68368 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2221/68381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L33/20 (with a particular shape, e.g. curved or truncated substrate): 1 patents
- H01L25/0753 (the devices being of a type provided for in group): 1 patents
Companies
File:Hiroaki KAGEYAMA Top Companies.png
List of Companies
- Nichia Corporation: 1 patents
- NICHIA CORPORATION: 1 patents