Category:Hiroyuki KASAMA
Hiroyuki KASAMA
Executive Summary
Hiroyuki KASAMA is an inventor who has filed 1 patents. Their primary areas of innovation include Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), {for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions (1 patents), and they have worked with companies such as SHINKAWA LTD. (1 patents). Their most frequent collaborators include .
Patent Filing Activity
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Technology Areas
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List of Technology Areas
- H01L21/67138 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
- H01L21/603 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions): 1 patents
Companies
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List of Companies
- SHINKAWA LTD.: 1 patents