Category:Hui-Zhong ZHUANG

Hui-Zhong ZHUANG

Executive Summary

Hui-Zhong ZHUANG is an inventor who has filed 7 patents. Their primary areas of innovation include {Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique} (4 patents), Floor-planning or layout, e.g. partitioning or placement (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (6 patents), Taiwan Semiconductor Manufacturing Company, Ltd. (1 patents). Their most frequent collaborators include (4 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

File:Hui-Zhong ZHUANG Monthly Patent Applications.png

Technology Areas

File:Hui-Zhong ZHUANG Top Technology Areas.png

List of Technology Areas

• H01L27/0207 ({Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique}): 4 patents
• G06F30/392 (Floor-planning or layout, e.g. partitioning or placement): 2 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/041 (the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer): 1 patents
• H01L21/823871 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
• H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L23/5221 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L29/41725 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/4238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/768 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L27/11807 (Masterslice integrated circuits): 1 patents
• H01L2027/11875 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/0002 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
• H01L21/76897 ({Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step (self-aligned silicidation on field effect transistors): 1 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 1 patents
• H10D84/645 (No explanation available): 1 patents
• G01K7/01 (MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry): 1 patents
• H10D10/061 (No explanation available): 1 patents
• H10D10/60 (No explanation available): 1 patents
• H10D62/115 (No explanation available): 1 patents
• H10D62/134 (No explanation available): 1 patents
• H10D62/184 (No explanation available): 1 patents
• H10D84/0119 (No explanation available): 1 patents
• H10D84/038 (No explanation available): 1 patents

Companies

File:Hui-Zhong ZHUANG Top Companies.png

List of Companies

• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.: 6 patents
• Taiwan Semiconductor Manufacturing Company, Ltd.: 1 patents

Collaborators

• Chih-Liang CHEN (4 collaborations)
• Chi-Yu LU (2 collaborations)
• Jia-Hong GAO (1 collaborations)
• Wei-Hsin TSAI (1 collaborations)
• Li-Chun TIEN (1 collaborations)
• Jung-Chan YANG (1 collaborations)
• Cheng-Yu LIN (1 collaborations)
• Yi-Lin FAN (1 collaborations)
• Sheng-Hsiung CHEN (1 collaborations)
• Jerry Chang Jui KAO (1 collaborations)
• Xiangdong CHEN (1 collaborations)
• Shang-Chih HSIEH (1 collaborations)
• Chun-Fu CHEN (1 collaborations)
• Ting-Wei CHIANG (1 collaborations)
• Hsiang-Jen TSENG (1 collaborations)
• Chih-Yu LAI (1 collaborations)
• Shang-Syuan CIOU (1 collaborations)
• Ching-Wei TSAI (1 collaborations)
• Shang-Wen CHANG (1 collaborations)
• Chia-Chung CHEN (1 collaborations)
• Szu-Lin LIU (1 collaborations)
• Jaw-Juinn HORNG (1 collaborations)
• Ya Yun LIU (1 collaborations)