Category:Jacob R. Mauermann of Marion IA (US)

Jacob R. Mauermann of Marion IA (US)

Executive Summary

Jacob R. Mauermann of Marion IA (US) is an inventor who has filed 2 patents. Their primary areas of innovation include Assembling printed circuits with other printed circuits {( (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric (1 patents), and they have worked with companies such as BAE Systems Information and Electronic Systems Integration Inc. (1 patents), BAE SYSTEMS Information and Electronic Systems Integration Inc. (1 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H05K3/368 (Assembling printed circuits with other printed circuits {(): 1 patents
• H01L28/60 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01G4/012 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric): 1 patents
• H01G4/33 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/06 ({of a plurality of bonding areas}): 1 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L28/65 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01G4/228 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric): 1 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05548 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05551 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05572 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05624 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05639 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05644 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0603 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06051 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0616 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13007 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• BAE Systems Information and Electronic Systems Integration Inc.: 1 patents
• BAE SYSTEMS Information and Electronic Systems Integration Inc.: 1 patents

Collaborators

• Nathaniel P. Wyckoff of Marion IA (US) (2 collaborations)
• Benjamin Terry of Cedar Rapids IA (US) (1 collaborations)
• Justin D. Smith of North Liberty IA (US) (1 collaborations)
• Alexander S. Warren of North Liberty IA (US) (1 collaborations)
• William J. Klema of Marion IA (US) (1 collaborations)