Category:Jae Kyu Cho of Niskayuna NY (US)

Jae Kyu Cho of Niskayuna NY (US)

Executive Summary

Jae Kyu Cho of Niskayuna NY (US) is an inventor who has filed 2 patents. Their primary areas of innovation include of the integrated circuit kind (electric integrated circuits (2 patents), OPTICAL ELEMENTS, SYSTEMS OR APPARATUS (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as GlobalFoundries U.S. Inc. (2 patents). Their most frequent collaborators include (1 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• G02B6/1228 (of the integrated circuit kind (electric integrated circuits): 2 patents
• G02B6/13 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/21 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• G02B6/12002 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/43 (Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections): 1 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/82 ({by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] (interconnection structure between a plurality of semiconductor chips): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/24155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/24227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/82101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/404 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• GlobalFoundries U.S. Inc.: 2 patents

Collaborators

• Norman Robson of Fishkill NY (US) (1 collaborations)