Category:Jared Dupree Williams of Seattle WA (US)

Jared Dupree Williams of Seattle WA (US)

Executive Summary

Jared Dupree Williams of Seattle WA (US) is an inventor who has filed 1 patents. Their primary areas of innovation include using an overlay routing layer (1 patents), {using a combination of metrics} (1 patents), and they have worked with companies such as Johnson Controls Tyco IP Holdings LLP (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Jared Dupree Williams of Seattle WA (US) Monthly Patent Applications.png

Technology Areas

File:Jared Dupree Williams of Seattle WA (US) Top Technology Areas.png

List of Technology Areas

• H04L45/64 (using an overlay routing layer): 1 patents
• H04L45/124 ({using a combination of metrics}): 1 patents

Companies

File:Jared Dupree Williams of Seattle WA (US) Top Companies.png

List of Companies

• Johnson Controls Tyco IP Holdings LLP: 1 patents

Collaborators

• Nicholas Anthony Marrone of Seattle WA (US) (1 collaborations)
• Bryan David Skene of Seattle WA (US) (1 collaborations)