Category:Joel Richard Goergen of Soulsbyville CA (US)

Joel Richard Goergen of Soulsbyville CA (US)

Executive Summary

Joel Richard Goergen of Soulsbyville CA (US) is an inventor who has filed 9 patents. Their primary areas of innovation include Current supply arrangements (3 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), for high frequency, e.g. RJ 45 (1 patents), and they have worked with companies such as Cisco Technology, Inc. (9 patents). Their most frequent collaborators include (5 collaborations), (4 collaborations), (3 collaborations).

Patent Filing Activity

File:Joel Richard Goergen of Soulsbyville CA (US) Monthly Patent Applications.png

Technology Areas

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List of Technology Areas

• H04L12/10 (Current supply arrangements): 3 patents
• H05K2201/09481 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H01R24/64 (for high frequency, e.g. RJ 45): 1 patents
• H01R2107/00 (Four or more poles): 1 patents
• H01R2201/04 (ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS): 1 patents
• H02B1/26 (Casings; Parts thereof or accessories therefor): 1 patents
• H02B1/01 (BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER): 1 patents
• H02B1/20 (BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER): 1 patents
• H04L41/0659 (by isolating or reconfiguring faulty entities): 1 patents
• G08B5/22 (SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS): 1 patents
• H04L12/12 (Arrangements for remote connection or disconnection of substations or of equipment thereof): 1 patents
• G06F1/266 ({Arrangements to supply power to external peripherals either directly from the computer or under computer control, e.g. supply of power through the communication port, computer controlled power-strips}): 1 patents
• H05K7/1485 (Mounting supporting structure in casing or on frame or rack): 1 patents
• H05K1/113 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/0218 ({by printed shielding conductors, ground planes or power plane (): 1 patents
• H05K3/4038 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H03M13/03 (CODING; DECODING; CODE CONVERSION IN GENERAL (using fluidic means): 1 patents
• H03M13/373 (CODING; DECODING; CODE CONVERSION IN GENERAL (using fluidic means): 1 patents
• H04B3/54 (TRANSMISSION): 1 patents
• H04L41/12 (Discovery or management of network topologies): 1 patents
• H04W80/02 (WIRELESS COMMUNICATION NETWORKS (broadcast communication): 1 patents
• H03M13/1515 (CODING; DECODING; CODE CONVERSION IN GENERAL (using fluidic means): 1 patents
• H04B2203/542 (TRANSMISSION): 1 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L2224/05555 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/0251 ({Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (): 1 patents
• H05K1/0222 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/0939 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09609 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H02M3/1584 (APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers): 1 patents
• G06F1/18 (Packaging or power distribution): 1 patents
• H02J1/106 (Parallel operation of dc sources): 1 patents
• H02M3/1586 (APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers): 1 patents

Companies

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List of Companies

• Cisco Technology, Inc.: 9 patents

Collaborators

• Chad M. Jones of Doylestown OH (US) (5 collaborations)
• George Allan Zimmerman of Manhattan Beach CA (US) (4 collaborations)
• Jason Dewayne Potterf of Austin TX (US) (3 collaborations)
• Elizabeth Kochuparambil of Morgan Hill CA (US) (3 collaborations)
• Mike Sapozhnikov of San Jose CA (US) (3 collaborations)
• David Nozadze of San Jose CA (US) (3 collaborations)
• Upen Reddy Kareti of Union City CA (US) (2 collaborations)
• Richard Anthony O'Brien of Livermore CA (US) (2 collaborations)
• Jason DeWayne Potterf of Austin TX (US) (2 collaborations)
• Amendra Koul of San Francisco CA (US) (2 collaborations)
• Sayed Ashraf Mamun of San Jose CA (US) (2 collaborations)
• Douglas Paul Arduini of Florence OR (US) (1 collaborations)
• Angelo Fienga (1 collaborations)
• Maria Soledad Palmero Amador (1 collaborations)
• Hazim Hashim Dahir of Wake Forest NC (US) (1 collaborations)
• Wenbin Ma (1 collaborations)
• Weiying Ding (1 collaborations)
• Douglas Paul Arduini of San Ramon CA (US) (1 collaborations)
• Sung Kee Baek of San Ramon CA (US) (1 collaborations)
• Srinath Penugonda of Milpitas CA (US) (1 collaborations)