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Category:John D. Reed of Dayton OH US

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John D. Reed

John D. Reed from Dayton OH US has applied for patents in technology areas such as A61B5/0205, A61B5/00, A61B5/01 with CareBand Inc..

Patents

EDGE COMPUTING SYSTEM WITH LOW POWER WIDE AREA NETWORK CONNECTIVITY AND AUTONOMOUS OR SEMI-AUTONOMOUS MACHINE LEARNING (20250009237)

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