Category:Jong Bae SHIN

Jong Bae SHIN

Executive Summary

Jong Bae SHIN is an inventor who has filed 3 patents. Their primary areas of innovation include PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (1 patents), {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} (1 patents), Earthing means; Earth screens; Counterpoises (1 patents), and they have worked with companies such as LG INNOTEK CO., LTD. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

File:Jong Bae SHIN Monthly Patent Applications.png

Technology Areas

File:Jong Bae SHIN Top Technology Areas.png

List of Technology Areas

• H05K1/0243 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01Q1/2283 ({mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}): 1 patents
• H01Q1/48 (Earthing means; Earth screens; Counterpoises): 1 patents
• H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/10098 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/183 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H01L23/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
• H05K1/0218 ({by printed shielding conductors, ground planes or power plane (): 1 patents
• H05K1/113 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K3/4697 (Manufacturing multilayer circuits): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H05K2201/094 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09481 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09527 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/096 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09618 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09781 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09827 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/0237 ({using auxiliary mounted passive components or auxiliary substances (printed passive components): 1 patents
• H05K1/11 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

Companies

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List of Companies

• LG INNOTEK CO., LTD.: 3 patents

Collaborators

• Soo Min LEE (3 collaborations)
• Jae Hun JEONG (3 collaborations)
• Ji Chul JUNG (2 collaborations)
• Moo Seong KIM (1 collaborations)