Category:Kai HUANG

Kai HUANG

Executive Summary

Kai HUANG is an inventor who has filed 1 patents. Their primary areas of innovation include {Processes} (1 patents), the devices being of a type provided for in group (1 patents), Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls (1 patents), and they have worked with companies such as XIAMEN UNIVERSITY (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Kai HUANG Monthly Patent Applications.png

Technology Areas

File:Kai HUANG Top Technology Areas.png

List of Technology Areas

• H01L33/005 ({Processes}): 1 patents
• H01L25/0753 (the devices being of a type provided for in group): 1 patents
• H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
• H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Kai HUANG Top Companies.png

List of Companies

• XIAMEN UNIVERSITY: 1 patents

Collaborators

• Xiaowei ZHANG (1 collaborations)
• Xu YANG (1 collaborations)
• Jinchai LI (1 collaborations)
• Rong ZHANG (1 collaborations)