Category:Keisuke SHINOMIYA

Keisuke SHINOMIYA

Executive Summary

Keisuke SHINOMIYA is an inventor who has filed 1 patents. Their primary areas of innovation include {Manufacturing methods (for bumps on insulating substrates (1 patents), with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as LINTEC CORPORATION (1 patents). Their most frequent collaborators include (1 collaborations).

Patent Filing Activity

File:Keisuke SHINOMIYA Monthly Patent Applications.png

Technology Areas

File:Keisuke SHINOMIYA Top Technology Areas.png

List of Technology Areas

• H01L24/11 ({Manufacturing methods (for bumps on insulating substrates): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L2224/11019 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Keisuke SHINOMIYA Top Companies.png

List of Companies

• LINTEC CORPORATION: 1 patents

Collaborators

• Tomotaka MORISHITA (1 collaborations)