Category:Liang Wang of Milpitas CA (US)

Liang Wang of Milpitas CA (US)

Executive Summary

Liang Wang of Milpitas CA (US) is an inventor who has filed 1 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), Manufacture or treatment of devices or systems in or on a substrate ( (1 patents), Manufacture or treatment of devices or systems in or on a substrate ( (1 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Liang Wang of Milpitas CA (US) Monthly Patent Applications.png

Technology Areas

File:Liang Wang of Milpitas CA (US) Top Technology Areas.png

List of Technology Areas

H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
B81C1/00269 (Manufacture or treatment of devices or systems in or on a substrate (): 1 patents
B81C1/00293 (Manufacture or treatment of devices or systems in or on a substrate (): 1 patents
H01L23/10 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
H01L23/53228 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/53242 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L24/06 ({of a plurality of bonding areas}): 1 patents
H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
B81B2207/012 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents
B81C2203/035 (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons): 1 patents
H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
H01L2224/05551 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05552 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05555 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05686 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/06135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/06155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/06165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/06505 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/08121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/08237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/29019 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/8001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80047 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80948 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H05K1/111 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents