Category:Masaru NAKAMURA
Masaru NAKAMURA
Executive Summary
Masaru NAKAMURA is an inventor who has filed 3 patents. Their primary areas of innovation include {Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general (2 patents), with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies (1 patents), MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth (1 patents), and they have worked with companies such as DISCO CORPORATION (3 patents). Their most frequent collaborators include .
Patent Filing Activity
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Technology Areas
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List of Technology Areas
- H01L21/6836 ({Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general): 2 patents
- H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
- B24B41/068 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth): 1 patents
- B24B41/005 ({Feeding or manipulating devices specially adapted to grinding machines (feeding, loading or unloading work specially adapted to lapping machines): 1 patents
- H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 1 patents
- B24B7/228 ({for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts): 1 patents
Companies
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List of Companies
- DISCO CORPORATION: 3 patents