Category:Masaya TOBA

Masaya TOBA

Executive Summary

Masaya TOBA is an inventor who has filed 4 patents. Their primary areas of innovation include Printed circuits structurally associated with non-printed electric components ({ (2 patents), {by electroless plating (adhesives therefor (2 patents), {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} (2 patents), and they have worked with companies such as Resonac Corporation (3 patents), RESONAC CORPORATION (1 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (1 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H05K1/181 (Printed circuits structurally associated with non-printed electric components ({): 2 patents
• H05K3/181 ({by electroless plating (adhesives therefor): 2 patents
• H05K3/022 ({Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}): 2 patents
• H05K3/1208 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
• H05K3/107 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K3/025 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H05K2201/10553 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/0358 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2203/1377 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/0209 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

Companies

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List of Companies

• Resonac Corporation: 3 patents
• RESONAC CORPORATION: 1 patents

Collaborators

• Kazuyuki MITSUKURA (4 collaborations)
• Masaki YAMAGUCHI (3 collaborations)
• Kei TOGASAKI (1 collaborations)
• Kenichi IWASHITA (1 collaborations)
• Keishi ONO (1 collaborations)
• Mao NARITA (1 collaborations)