Category:Michael J. SEDDON of Gilbert AZ (US)

Michael J. SEDDON of Gilbert AZ (US)

Executive Summary

Michael J. SEDDON of Gilbert AZ (US) is an inventor who has filed 8 patents. Their primary areas of innovation include with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies (5 patents), Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes (3 patents), Bombardment with radiation {( (2 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (8 patents). Their most frequent collaborators include (3 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Michael J. SEDDON of Gilbert AZ (US) Monthly Patent Applications.png

Technology Areas

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List of Technology Areas

• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 5 patents
• H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 3 patents
• H01L21/268 (Bombardment with radiation {(): 2 patents
• H01L23/12 (Mountings, e.g. non-detachable insulating substrates): 2 patents
• H01L21/6836 ({Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general): 2 patents
• H01L21/0274 (Making masks on semiconductor bodies for further photolithographic processing not provided for in group): 1 patents
• H01L21/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/32051 (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers (manufacture of electrodes): 1 patents
• H01L21/32131 ({by physical means only}): 1 patents
• H01L22/20 ({Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps}): 1 patents
• H01L2223/5446 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/302 (Treatment of semiconductor bodies using processes or apparatus not provided for in groups): 1 patents
• H01L21/48 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3185 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/04 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/26 ({Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto}): 1 patents
• H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5222 ({Capacitive arrangements or effects of, or between wiring layers (other capacitive arrangements): 1 patents
• H01L21/0226 ({the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides (adhesion layers or buffer layers): 1 patents
• H01L21/786 (the substrate being other than a semiconductor body, e.g. insulating body): 1 patents
• H01L23/34 (Arrangements for cooling, heating, ventilating or temperature compensation {; Temperature sensing arrangements (thermal treatment apparatus): 1 patents
• H01L21/02076 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/3043 ({Making grooves, e.g. cutting}): 1 patents
• B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L23/145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/32 (Holders for supporting the complete device in operation, i.e. detachable fixtures (): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 1 patents
• B21D11/10 (WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL (working or processing of wire): 1 patents
• H01L21/02035 ({Shaping}): 1 patents
• H01L21/76871 ({Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers}): 1 patents
• H01L21/32136 ({using plasmas}): 1 patents
• H01L21/32139 ({using masks}): 1 patents
• H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 8 patents

Collaborators

• Francis J. CARNEY of Mesa AZ (US) (3 collaborations)
• Chee Hiong CHEW (1 collaborations)
• Soon Wei WANG (1 collaborations)
• Eiji KUROSE (1 collaborations)
• Mark GRISWOLD of Gilbert AZ (US) (1 collaborations)