Category:Ming-Hsi Yeh

Ming-Hsi Yeh

Executive Summary

Ming-Hsi Yeh is an inventor who has filed 7 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (7 patents). Their most frequent collaborators include (4 collaborations), (4 collaborations), (2 collaborations).

Patent Filing Activity

File:Ming-Hsi Yeh Monthly Patent Applications.png

Technology Areas

File:Ming-Hsi Yeh Top Technology Areas.png

List of Technology Areas

• H01L29/66795 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L21/823821 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 3 patents
• H01L27/0924 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 3 patents
• H01L29/7854 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/32134 ({by liquid etching only}): 2 patents
• H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
• H01L29/785 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/6681 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/845 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/28247 (Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups): 1 patents
• H01L21/28088 (Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups): 1 patents
• H01L21/28185 ({with a treatment, e.g. annealing, after the formation of the gate insulator and before the formation of the definitive gate conductor}): 1 patents
• H01L21/823842 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823857 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/4966 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66568 ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 1 patents
• H01L21/28079 (Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups): 1 patents
• H01L21/0274 (Making masks on semiconductor bodies for further photolithographic processing not provided for in group): 1 patents
• H01L21/308 (using masks (): 1 patents
• G03F1/46 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices): 1 patents
• G03F7/091 ({characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement}): 1 patents
• H01L21/0276 ({using an anti-reflective coating (anti-reflective coating for lithography in general): 1 patents
• H01L21/82345 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/32135 (Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer): 1 patents
• H01L21/32136 ({using plasmas}): 1 patents
• H01L21/823437 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823828 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823864 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823878 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents

Companies

File:Ming-Hsi Yeh Top Companies.png

List of Companies

• Taiwan Semiconductor Manufacturing Co., Ltd.: 7 patents

Collaborators

• Chun-Neng Lin (4 collaborations)
• Kuo-Bin Huang (4 collaborations)
• Jian-Jou Lian (2 collaborations)
• Chieh-Wei Chen (2 collaborations)
• Tzu-Ang Chiang (2 collaborations)
• Ying-Liang Chuang (2 collaborations)
• Chia-Ling Chung (1 collaborations)
• Chun-Chih Cheng (1 collaborations)
• Shun-Wu Lin (1 collaborations)
• Ju-Li Huang (1 collaborations)
• Yu-Shih Wang (1 collaborations)
• Hong-Jie Yang (1 collaborations)
• Chia-Ying Lee (1 collaborations)
• Po-Nan Yeh (1 collaborations)
• U-Ting Chiu (1 collaborations)
• Hung-Chin Chung (1 collaborations)
• Hsin-Yun Hsu (1 collaborations)
• Ming-Chi Huang (1 collaborations)