Category:Ming-Hsiu Lee

Ming-Hsiu Lee

Executive Summary

Ming-Hsiu Lee is an inventor who has filed 2 patents. Their primary areas of innovation include using electronic means (1 patents), with three charge-transfer gates, e.g. MOS transistors, per cell (1 patents), Sense or sense/refresh amplifiers, or associated sense circuitry, e.g. for coupled bit-line precharging, equalising or isolating (1 patents), and they have worked with companies such as Macronix International Co., Ltd. (1 patents), MACRONIX International Co., Ltd. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Ming-Hsiu Lee Monthly Patent Applications.png

Technology Areas

File:Ming-Hsiu Lee Top Technology Areas.png

List of Technology Areas

• G06N3/063 (using electronic means): 1 patents
• G11C11/405 (with three charge-transfer gates, e.g. MOS transistors, per cell): 1 patents
• G11C11/4091 (Sense or sense/refresh amplifiers, or associated sense circuitry, e.g. for coupled bit-line precharging, equalising or isolating): 1 patents
• G11C11/4096 (Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches): 1 patents
• G11C11/54 (using elements simulating biological cells, e.g. neuron): 1 patents
• H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/32051 (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers (manufacture of electrodes): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L24/06 ({of a plurality of bonding areas}): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
• H01L2224/06181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents

Companies

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List of Companies

• Macronix International Co., Ltd.: 1 patents
• MACRONIX International Co., Ltd.: 1 patents

Collaborators

• Feng-Min Lee (1 collaborations)
• Po-Hao Tseng (1 collaborations)
• Yu-Yu Lin (1 collaborations)
• Cheng-Hsien Lu (1 collaborations)
• Dai-Ying Lee (1 collaborations)