Paul Frank

Paul Frank from Finkenstein am Faaker See AT has applied for patents in technology areas such as H01L23/495, H01L21/78, H01L23/00 with Infineon Technologies Austria AG.

Patents

• [[Infineon Technologies Austria AG (18975505). SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICALLY AND MECHANICALLY COUPLING FIRST AND SECOND POWER SEMICONDUCTOR CHIPS TO A LEADFRAME PART AND METHOD FOR FABRICATING THEA SEMICONDUCTOR PACKAGE|SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICALLY AND MECHANICALLY COUPLING FIRST AND SECOND POWER SEMICONDUCTOR CHIPS TO A LEADFRAME PART AND METHOD FOR FABRICATING THEA SEMICONDUCTOR PACKAGE (18975505)]]