Category:Peng Chen

Peng Chen

Executive Summary

Peng Chen is an inventor who has filed 5 patents. Their primary areas of innovation include SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal (2 patents), taking account of the properties of the material involved (2 patents), SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal (2 patents), and they have worked with companies such as Yangtze Memory Technologies Co., Ltd. (3 patents), YANGTZE MEMORY TECHNOLOGIES CO., LTD. (2 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Peng Chen Monthly Patent Applications.png

Technology Areas

File:Peng Chen Top Technology Areas.png

List of Technology Areas

• B23K26/38 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
• B23K26/40 (taking account of the properties of the material involved): 2 patents
• B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
• H01L23/3675 (Cooling facilitated by shape of device {(): 1 patents
• H01L23/3738 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/065 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/16251 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/566 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/67126 ({Apparatus for sealing, encapsulating, glassing, decapsulating or the like (processes): 1 patents
• H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/8221 ({Three dimensional integrated circuits stacked in different levels}): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
• H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1438 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Peng Chen Top Companies.png

List of Companies

• Yangtze Memory Technologies Co., Ltd.: 3 patents
• YANGTZE MEMORY TECHNOLOGIES CO., LTD.: 2 patents

Collaborators

• Ping Mo (2 collaborations)
• Liquan Cai (2 collaborations)
• Houde Zhou (2 collaborations)
• Xin Feng (1 collaborations)
• Shanshan Zhao (1 collaborations)
• Weisong Qian (1 collaborations)
• Wei Xie (1 collaborations)
• Hong Fang (1 collaborations)
• Lei Liu (1 collaborations)
• Zhiliang Xia (1 collaborations)