Category:Roman J. Churnovic of Manhattan IL (US)

Roman J. Churnovic of Manhattan IL (US)

Executive Summary

Roman J. Churnovic of Manhattan IL (US) is an inventor who has filed 3 patents. Their primary areas of innovation include assembled by snap action of the parts (2 patents), Shield structure (1 patents), Specific features or arrangements of connection of shield to conductive members (1 patents), and they have worked with companies such as Panduit Corp. (3 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

H01R13/506 (assembled by snap action of the parts): 2 patents
H01R13/6581 (Shield structure): 1 patents
H01R13/65912 (Specific features or arrangements of connection of shield to conductive members): 1 patents
H01R13/6582 (with resilient means for engaging mating connector): 1 patents
H01R4/2429 (Connections using contact members penetrating or cutting insulation or cable strands): 1 patents
H01R24/64 (for high frequency, e.g. RJ 45): 1 patents
H01R2201/04 (ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS): 1 patents
H01R13/659 (with plural ports for distinct connectors): 1 patents
H01R31/06 (Intermediate parts for linking two coupling parts, e.g. adapter (with a holder adapted for supporting apparatus to which its counterpart is attached): 1 patents
H01R24/84 (Hermaphroditic coupling devices): 1 patents