Category:Roveendra PAUL of Dublin CA (US)

Roveendra PAUL of Dublin CA (US)

Executive Summary

Roveendra PAUL of Dublin CA (US) is an inventor who has filed 5 patents. Their primary areas of innovation include Printed circuits structurally associated with non-printed electric components ({ (2 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (3 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H05K1/18 (Printed circuits structurally associated with non-printed electric components ({): 2 patents
• H05K1/11 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H05K2201/10166 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/82 ({by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] (interconnection structure between a plurality of semiconductor chips): 1 patents
• H01L25/072 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49562 (Lead-frames {or other flat leads (): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73221 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K7/20927 (Modifications to facilitate cooling, ventilating, or heating): 1 patents

Companies

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List of Companies

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 5 patents

Collaborators

• Oseob JEON (4 collaborations)
• Seungwon IM (3 collaborations)
• Rajani Kumar THIRUKOLURI (3 collaborations)
• Olaf ZSCHIESCHANG (1 collaborations)
• Jihwan KIM (1 collaborations)
• Klaus NEUMAIER (1 collaborations)
• Jerome TEYSSEYRE (1 collaborations)
• Hyungsoo KIM (1 collaborations)