Category:Ryota KATSUMATA

Ryota KATSUMATA

Executive Summary

Ryota KATSUMATA is an inventor who has filed 6 patents. Their primary areas of innovation include ELECTRONIC MEMORY DEVICES (6 patents), ELECTRONIC MEMORY DEVICES (4 patents), ELECTRONIC MEMORY DEVICES (4 patents), and they have worked with companies such as Kioxia Corporation (3 patents), KIOXIA CORPORATION (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (3 collaborations).

Patent Filing Activity

File:Ryota KATSUMATA Monthly Patent Applications.png

Technology Areas

File:Ryota KATSUMATA Top Technology Areas.png

List of Technology Areas

• H10B43/27 (ELECTRONIC MEMORY DEVICES): 6 patents
• H10B43/20 (ELECTRONIC MEMORY DEVICES): 4 patents
• H10B41/27 (ELECTRONIC MEMORY DEVICES): 4 patents
• H10B43/40 (ELECTRONIC MEMORY DEVICES): 4 patents
• H10B43/35 (ELECTRONIC MEMORY DEVICES): 3 patents
• H10B43/50 (ELECTRONIC MEMORY DEVICES): 3 patents
• G11C16/0483 ({comprising cells having several storage transistors connected in series}): 2 patents
• H01L21/823437 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/66833 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/792 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7926 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/223 (using diffusion into or out of a solid from or into a gaseous phase {(): 1 patents
• H01L21/265 (producing ion implantation): 1 patents
• H01L29/66666 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7827 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/04 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/42344 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/4916 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/1037 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/8221 ({Three dimensional integrated circuits stacked in different levels}): 1 patents
• H01L27/0688 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/105 (including field-effect components): 1 patents
• H10B69/00 (Erasable-and-programmable ROM [EPROM] devices not provided for in groups): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B41/10 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B43/10 (ELECTRONIC MEMORY DEVICES): 1 patents
• H01L2224/05025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/743 ({Making of internal connections, substrate contacts}): 1 patents
• H01L21/76889 ({by deposition over sacrificial masking layer, e.g. lift-off (lift-off per se): 1 patents
• H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
• H01L25/00 (Assemblies consisting of a plurality of individual semiconductor or other solid state devices {; Multistep manufacturing processes thereof} (devices consisting of a plurality of solid state components formed in or on a common substrate): 1 patents
• H01L2924/0002 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B99/00 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B41/20 (ELECTRONIC MEMORY DEVICES): 1 patents

Companies

File:Ryota KATSUMATA Top Companies.png

List of Companies

• Kioxia Corporation: 3 patents
• KIOXIA CORPORATION: 3 patents

Collaborators

• Yoshiaki FUKUZUMI (3 collaborations)
• Masaru KITO (3 collaborations)
• Masaru KIDOH (3 collaborations)
• Hiroyasu TANAKA (3 collaborations)
• Hideaki AOCHI (3 collaborations)
• Yosuke KOMORI (2 collaborations)
• Megumi ISHIDUKI (2 collaborations)
• Tomoo HISHIDA (1 collaborations)
• Sadatoshi MURAKAMI (1 collaborations)
• Masao IWASE (1 collaborations)
• Junya MATSUNAMI (1 collaborations)
• Tomoko FUJIWARA (1 collaborations)
• Ryouhei KIRISAWA (1 collaborations)
• Yoshimasa MIKAJIRI (1 collaborations)
• Shigeto OOTA (1 collaborations)
• Akihiro NITAYAMA (1 collaborations)
• Yasuyuki MATSUOKA (1 collaborations)
• Mitsuru SATO (1 collaborations)
• Masayoshi TAGAMI (1 collaborations)
• Jun IIJIMA (1 collaborations)
• Tetsuya SHIMIZU (1 collaborations)
• Takamasa USUI (1 collaborations)
• Genki FUJITA (1 collaborations)
• Yoshihiro AKUTSU (1 collaborations)