Sang-Jae Lee

Sang-Jae Lee from San Diego CA (US) has applied for patents in technology areas such as H01L23/538, H01L21/48, H01L25/16 with qualcomm incorporated.

Patents

• PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDITIONAL METAL PAD LAYER TO FACILITATE REDUCED VIA SIZE FOR REDUCED BUMP PITCH, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS (20250062235)