Category:Shuuichi KARIYAZAKI
Shuuichi KARIYAZAKI
Executive Summary
Shuuichi KARIYAZAKI is an inventor who has filed 2 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), {of a plurality of bump connectors} (1 patents), {Multilayer substrates (multilayer metallisation on monolayer substrate (1 patents), and they have worked with companies such as Renesas Electronics Corporation (2 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).
Patent Filing Activity
File:Shuuichi KARIYAZAKI Monthly Patent Applications.png
Technology Areas
File:Shuuichi KARIYAZAKI Top Technology Areas.png
List of Technology Areas
- H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L24/14 ({of a plurality of bump connectors}): 1 patents
- H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
- H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
- H01L24/04 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/14132 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/14133 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2924/1517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
- H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
Companies
File:Shuuichi KARIYAZAKI Top Companies.png
List of Companies
- Renesas Electronics Corporation: 2 patents
Collaborators
- Keita TSUCHIYA (1 collaborations)
- Kazuo SAKAMOTO (1 collaborations)
- Ryuichi OIKAWA (1 collaborations)