Category:Siegfried Herrmann
Siegfried Herrmann
Executive Summary
Siegfried Herrmann is an inventor who has filed 2 patents. Their primary areas of innovation include Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls (1 patents), the devices being of a type provided for in group (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as ams-OSRAM International GmbH (2 patents). Their most frequent collaborators include .
Patent Filing Activity
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Technology Areas
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List of Technology Areas
- H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
- H01L25/0753 (the devices being of a type provided for in group): 1 patents
- H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- G01R31/2644 (Testing of individual semiconductor devices (testing or measuring during manufacture or treatment {): 1 patents
- G01R31/2635 (Testing of individual semiconductor devices (testing or measuring during manufacture or treatment {): 1 patents
- H01L33/0095 ({Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination}): 1 patents
- H01L33/36 (characterised by the electrodes): 1 patents
Companies
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List of Companies
- ams-OSRAM International GmbH: 2 patents