Category:Sung-Feng Yeh

Sung-Feng Yeh

Executive Summary

Sung-Feng Yeh is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (5 patents). Their most frequent collaborators include (4 collaborations), (4 collaborations), (2 collaborations).

Patent Filing Activity

File:Sung-Feng Yeh Monthly Patent Applications.png

Technology Areas

File:Sung-Feng Yeh Top Technology Areas.png

List of Technology Areas

• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 3 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/06 ({of a plurality of bonding areas}): 2 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 2 patents
• H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29021 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/182 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/42 (Fillings or auxiliary members in containers {or encapsulations} selected or arranged to facilitate heating or cooling): 1 patents
• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06131 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06133 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H01L23/291 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/293 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/19011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/19102 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5383 ({Multilayer substrates (): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0346 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05008 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/04642 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/05042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/05994 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5227 ({Inductive arrangements or effects of, or between, wiring layers (other inductive arrangements): 1 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0603 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1436 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Sung-Feng Yeh Top Companies.png

List of Companies

• Taiwan Semiconductor Manufacturing Co., Ltd.: 5 patents

Collaborators

• Kuo-Chiang Ting (4 collaborations)
• Ta Hao Sung (4 collaborations)
• Gao-Long Wu (2 collaborations)
• Jian-Wei Hong (1 collaborations)
• Shu-Yan Jhu (1 collaborations)
• Hsien-Wei Chen (1 collaborations)
• Ming-Zhi Yang (1 collaborations)
• Shin-Jiun Fu (1 collaborations)