Category:Takuma MORI

Takuma MORI

Executive Summary

Takuma MORI is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), the devices being of types provided for in two or more different main groups of groups (2 patents), and they have worked with companies such as SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. (3 patents). Their most frequent collaborators include (1 collaborations).

Patent Filing Activity

File:Takuma MORI Monthly Patent Applications.png

Technology Areas

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List of Technology Areas

• H01L23/66 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 2 patents
• H01L2223/6611 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/19041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49562 (Lead-frames {or other flat leads (): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2223/6655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/4814 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/13064 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/46 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/46 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48195 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D84/86 (No explanation available): 1 patents
• H10D30/475 (No explanation available): 1 patents
• H10D62/8503 (No explanation available): 1 patents
• H10D64/254 (No explanation available): 1 patents

Companies

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List of Companies

• SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.: 3 patents

Collaborators

• Fumio YAMADA (1 collaborations)