Category:Taro NISHIOKA

Taro NISHIOKA

Executive Summary

Taro NISHIOKA is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), Lead-frames {or other flat leads ( (2 patents), Lead-frames {or other flat leads ( (2 patents), and they have worked with companies such as ROHM CO., LTD. (5 patents). Their most frequent collaborators include (5 collaborations), (5 collaborations), (3 collaborations).

Patent Filing Activity

File:Taro NISHIOKA Monthly Patent Applications.png

Technology Areas

File:Taro NISHIOKA Top Technology Areas.png

List of Technology Areas

• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L23/49562 (Lead-frames {or other flat leads (): 2 patents
• H01L23/49503 (Lead-frames {or other flat leads (): 2 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/48247 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/19042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/48245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/45 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/45144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49537 (Lead-frames {or other flat leads (): 1 patents
• H01L23/645 ({Inductive arrangements (): 1 patents
• H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L31/02005 ({for device characterised by at least one potential jump barrier or surface barrier}): 1 patents
• H01L31/0203 (Containers; Encapsulations {, e.g. encapsulation of photodiodes} (for photovoltaic devices): 1 patents
• H01L33/56 (Materials, e.g. epoxy or silicone resin): 1 patents
• H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
• H01L31/18 (Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof): 1 patents
• H01L2933/005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49575 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49513 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49517 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49558 (Lead-frames {or other flat leads (): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L23/49579 (Lead-frames {or other flat leads (): 1 patents
• H01L24/46 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/45147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/45664 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/46 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48195 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48991 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48455 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/3512 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Taro NISHIOKA Top Companies.png

List of Companies

• ROHM CO., LTD.: 5 patents

Collaborators

• Yoshizo OSUMI (5 collaborations)
• Hiroaki MATSUBARA (5 collaborations)
• Tomohira KIKUCHI (3 collaborations)
• Moe YAMAGUCHI (2 collaborations)
• Ryohei UMENO (2 collaborations)