Category:Tirunelveli Subramaniam Ravi of San Jose CA (US)

Tirunelveli Subramaniam Ravi of San Jose CA (US)

Executive Summary

Tirunelveli Subramaniam Ravi of San Jose CA (US) is an inventor who has filed 3 patents. Their primary areas of innovation include SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds, (2 patents), SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds, (2 patents), SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds, (2 patents), and they have worked with companies such as ThinSiC Inc. (3 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• C30B25/04 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 2 patents
• C30B29/36 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 2 patents
• C30B33/08 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 2 patents
• C30B29/66 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 1 patents
• H01L21/02529 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• C30B25/20 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 1 patents
• H01L21/02378 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02595 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02609 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02634 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02642 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 1 patents
• H01L21/3065 (Plasma etching; Reactive-ion etching): 1 patents
• H01L21/7813 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H10D8/051 (No explanation available): 1 patents
• H10D8/60 (No explanation available): 1 patents
• H10D62/8325 (No explanation available): 1 patents
• H10D89/013 (No explanation available): 1 patents
• H01L21/02019 ({Chemical etching}): 1 patents
• H01L21/02271 ({deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition (): 1 patents
• H01L21/02389 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• ThinSiC Inc.: 3 patents

Collaborators

• Jinho Seo of Saratoga CA (US) (2 collaborations)
• Bishnu Gogoi of Scottsdale AZ (US) (1 collaborations)