Category:Yee-Chia Yeo

Yee-Chia Yeo

Executive Summary

Yee-Chia Yeo is an inventor who has filed 6 patents. Their primary areas of innovation include No explanation available (3 patents), No explanation available (3 patents), No explanation available (3 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (6 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Yee-Chia Yeo Monthly Patent Applications.png

Technology Areas

File:Yee-Chia Yeo Top Technology Areas.png

List of Technology Areas

• H10D30/024 (No explanation available): 3 patents
• H10D30/6211 (No explanation available): 3 patents
• H10D84/038 (No explanation available): 3 patents
• H10D30/6219 (No explanation available): 2 patents
• H10D84/017 (No explanation available): 2 patents
• H10D84/0193 (No explanation available): 2 patents
• H10D84/853 (No explanation available): 2 patents
• H01L21/02532 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823821 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L27/0886 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/0924 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/28518 (from a gas or vapour, e.g. condensation): 1 patents
• H01L21/31111 ({by chemical means}): 1 patents
• H01L21/32133 ({by chemical means only}): 1 patents
• H01L21/3215 (Doping the layers): 1 patents
• H01L21/76805 ({the opening being a via or contact hole penetrating the underlying conductor}): 1 patents
• H01L21/76829 ({characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers}): 1 patents
• H01L21/7684 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/76892 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L23/53257 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
• H10D62/151 (No explanation available): 1 patents
• H10D64/62 (No explanation available): 1 patents
• H10D64/01 (No explanation available): 1 patents
• H10D64/258 (No explanation available): 1 patents
• H10D84/0186 (No explanation available): 1 patents
• H01L21/30604 (Chemical or electrical treatment, e.g. electrolytic etching (to form insulating layers): 1 patents
• H10D84/0188 (No explanation available): 1 patents
• H01L21/02667 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D62/299 (No explanation available): 1 patents
• H10D30/6713 (No explanation available): 1 patents
• H01L21/0259 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D30/031 (No explanation available): 1 patents
• H10D30/6735 (No explanation available): 1 patents
• H10D30/6757 (No explanation available): 1 patents
• H10D30/797 (No explanation available): 1 patents
• H10D62/021 (No explanation available): 1 patents
• H10D62/118 (No explanation available): 1 patents
• H10D64/018 (No explanation available): 1 patents
• H10D84/0167 (No explanation available): 1 patents
• H10D84/0184 (No explanation available): 1 patents
• H10D84/85 (No explanation available): 1 patents

Companies

File:Yee-Chia Yeo Top Companies.png

List of Companies

• Taiwan Semiconductor Manufacturing Co., Ltd.: 6 patents

Collaborators

• Pei-Ren Jeng (2 collaborations)
• Meng-Han Chou (2 collaborations)
• Su-Hao Liu (2 collaborations)
• Huicheng Chang (2 collaborations)
• Ta-Chun Ma (2 collaborations)
• Hung-Yao Chen (1 collaborations)
• Pin-Chu Liang (1 collaborations)
• Hsueh-Chang Sung (1 collaborations)
• Kuo-Ju Chen (1 collaborations)
• Liang-Yin Chen (1 collaborations)
• Yi-Syuan Siao (1 collaborations)
• Yi-Cheng Li (1 collaborations)
• Pin-Ju Liang (1 collaborations)
• Yan-Ting Lin (1 collaborations)
• Yen-Ru Lee (1 collaborations)
• Chien-Chang Su (1 collaborations)
• Chih-Yun Chin (1 collaborations)
• Chien-Wei Lee (1 collaborations)
• Pang-Yen Tsai (1 collaborations)
• Chii-Horng Li (1 collaborations)