Category:Yosuke HIMORI

Yosuke HIMORI

Executive Summary

Yosuke HIMORI is an inventor who has filed 3 patents. Their primary areas of innovation include Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se (1 patents), CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes (1 patents), Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor (1 patents), and they have worked with companies such as EBARA CORPORATION (3 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• B08B1/14 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B08B1/20 (Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor): 1 patents
• B08B1/34 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B08B3/041 ({Cleaning travelling work}): 1 patents
• H01L21/67034 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67046 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/68707 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H05F1/00 (Preventing the formation of electrostatic charges): 1 patents
• B08B1/40 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B08B1/36 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B24B5/162 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth): 1 patents
• B24B7/04 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth): 1 patents
• B24B27/003 (Other grinding machines or devices): 1 patents
• B24B27/04 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth): 1 patents
• B24B5/26 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth): 1 patents

Companies

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List of Companies

• EBARA CORPORATION: 3 patents

Collaborators

• Koichi FUKAYA (1 collaborations)
• Toshio MIZUNO (1 collaborations)