Category:Yue LI

Yue LI

Executive Summary

Yue LI is an inventor who has filed 6 patents. Their primary areas of innovation include Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (3 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (2 patents), {Via connections through the substrates, e.g. pins going through the substrate, coaxial cables ( (2 patents), and they have worked with companies such as Beijing BOE Optoelectronics Technology Co., Ltd. (6 patents). Their most frequent collaborators include (6 collaborations), (5 collaborations), (5 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 2 patents
• H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 2 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/15 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H05K2201/10015 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H05K2201/1003 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L2224/16237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/181 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H05K2201/10378 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/182 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H03H9/542 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing): 1 patents
• H03H3/02 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing): 1 patents
• H03H9/133 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing): 1 patents
• H03H9/17 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing): 1 patents
• H01L23/645 ({Inductive arrangements (): 1 patents
• H05K1/0306 (Use of materials for the substrate): 1 patents
• H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K3/4038 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09509 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H03H1/00 (Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network (constructional details of electromechanical transducers): 1 patents
• H03H3/00 (Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators): 1 patents
• H03H7/0115 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing): 1 patents

Companies

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List of Companies

• Beijing BOE Optoelectronics Technology Co., Ltd.: 6 patents

Collaborators

• Qichang AN (6 collaborations)
• Yifan WU (5 collaborations)
• Yuelei XIAO (5 collaborations)
• Yulin FENG (5 collaborations)
• Kidong HAN (4 collaborations)
• Jingshu ZHANG (3 collaborations)
• Biqi LI (3 collaborations)
• Huiying LI (3 collaborations)
• Zijian WANG (2 collaborations)
• Xiaodong LI (2 collaborations)
• Xue CAO (2 collaborations)
• Shuai XU (1 collaborations)
• Bin ZHAO (1 collaborations)
• Yingwei LIU (1 collaborations)
• Rui MA (1 collaborations)
• Quanyue LI (1 collaborations)
• Song CHEN (1 collaborations)
• Qianyu GUO (1 collaborations)
• Lihui WANG (1 collaborations)
• Qiuxu WEI (1 collaborations)
• Yanfei REN (1 collaborations)
• Wenbo CHANG (1 collaborations)
• Yi ZHOU (1 collaborations)
• Feng QU (1 collaborations)
• Hao YAN (1 collaborations)
• Chuncheng CHE (1 collaborations)