View source for Category:Liang Wang of Milpitas CA (US)

== Liang Wang of Milpitas CA (US) ==

=== Executive Summary ===
Liang Wang of Milpitas CA (US) is an inventor who has filed 1 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), Manufacture or treatment of devices or systems in or on a substrate  ( (1 patents), Manufacture or treatment of devices or systems in or on a substrate  ( (1 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (1 patents). Their most frequent collaborators include [[Category:Rajesh Katkar of San Jose CA (US)|Rajesh Katkar of San Jose CA (US)]] (1 collaborations), [[Category:Javier A. DeLaCruz of San Jose CA (US)|Javier A. DeLaCruz of San Jose CA (US)]] (1 collaborations), [[Category:Arkalgud R. Sitaram of Cupertino CA (US)|Arkalgud R. Sitaram of Cupertino CA (US)]] (1 collaborations).

=== Patent Filing Activity ===
[[File:Liang_Wang_of_Milpitas_CA_(US)_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Liang_Wang_of_Milpitas_CA_(US)_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L24/29|H01L24/29]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_B81C1/00269|B81C1/00269]] (Manufacture or treatment of devices or systems in or on a substrate  (): 1 patents
* [[:Category:CPC_B81C1/00293|B81C1/00293]] (Manufacture or treatment of devices or systems in or on a substrate  (): 1 patents
* [[:Category:CPC_H01L23/10|H01L23/10]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
* [[:Category:CPC_H01L23/528|H01L23/528]] ({Geometry or} layout of the interconnection structure {(): 1 patents
* [[:Category:CPC_H01L23/53228|H01L23/53228]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/53242|H01L23/53242]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/06|H01L24/06]] ({of a plurality of bonding areas}): 1 patents
* [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_B81B2207/012|B81B2207/012]] (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES  (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents
* [[:Category:CPC_B81C2203/035|B81C2203/035]] (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS  (making microcapsules or microballoons): 1 patents
* [[:Category:CPC_H01L23/562|H01L23/562]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
* [[:Category:CPC_H01L2224/05551|H01L2224/05551]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05552|H01L2224/05552]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05555|H01L2224/05555]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05571|H01L2224/05571]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05647|H01L2224/05647]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05686|H01L2224/05686]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/06135|H01L2224/06135]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/06155|H01L2224/06155]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/06165|H01L2224/06165]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/06505|H01L2224/06505]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08121|H01L2224/08121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08237|H01L2224/08237]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/29019|H01L2224/29019]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/8001|H01L2224/8001]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/80047|H01L2224/80047]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/80948|H01L2224/80948]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H05K1/111|H05K1/111]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

=== Companies ===
[[File:Liang_Wang_of_Milpitas_CA_(US)_Top_Companies.png|border|800px]]

==== List of Companies ====
* ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.: 1 patents

=== Collaborators ===
* [[:Category:Rajesh Katkar of San Jose CA (US)|Rajesh Katkar of San Jose CA (US)]][[Category:Rajesh Katkar of San Jose CA (US)]] (1 collaborations)
* [[:Category:Javier A. DeLaCruz of San Jose CA (US)|Javier A. DeLaCruz of San Jose CA (US)]][[Category:Javier A. DeLaCruz of San Jose CA (US)]] (1 collaborations)
* [[:Category:Arkalgud R. Sitaram of Cupertino CA (US)|Arkalgud R. Sitaram of Cupertino CA (US)]][[Category:Arkalgud R. Sitaram of Cupertino CA (US)]] (1 collaborations)

[[Category:Liang Wang of Milpitas CA (US)]]
[[Category:Inventors]]
[[Category:Inventors filing patents with ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.]]