View source for Category:Shuuichi KARIYAZAKI

== Shuuichi KARIYAZAKI ==

=== Executive Summary ===
Shuuichi KARIYAZAKI is an inventor who has filed 2 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), {of a plurality of bump connectors} (1 patents), {Multilayer substrates  (multilayer metallisation on monolayer substrate (1 patents), and they have worked with companies such as Renesas Electronics Corporation (2 patents). Their most frequent collaborators include [[Category:Keita TSUCHIYA|Keita TSUCHIYA]] (1 collaborations), [[Category:Kazuo SAKAMOTO|Kazuo SAKAMOTO]] (1 collaborations), [[Category:Ryuichi OIKAWA|Ryuichi OIKAWA]] (1 collaborations).

=== Patent Filing Activity ===
[[File:Shuuichi_KARIYAZAKI_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Shuuichi_KARIYAZAKI_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L24/14|H01L24/14]] ({of a plurality of bump connectors}): 1 patents
* [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates  (multilayer metallisation on monolayer substrate): 1 patents
* [[:Category:CPC_H01L23/5286|H01L23/5286]] ({Geometry or} layout of the interconnection structure {(): 1 patents
* [[:Category:CPC_H01L24/04|H01L24/04]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/0401|H01L2224/0401]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/14132|H01L2224/14132]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/14133|H01L2224/14133]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/16225|H01L2224/16225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/73204|H01L2224/73204]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/1517|H01L2924/1517]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
* [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/16227|H01L2224/16227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H10B80/00|H10B80/00]] (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents

=== Companies ===
[[File:Shuuichi_KARIYAZAKI_Top_Companies.png|border|800px]]

==== List of Companies ====
* Renesas Electronics Corporation: 2 patents

=== Collaborators ===
* [[:Category:Keita TSUCHIYA|Keita TSUCHIYA]][[Category:Keita TSUCHIYA]] (1 collaborations)
* [[:Category:Kazuo SAKAMOTO|Kazuo SAKAMOTO]][[Category:Kazuo SAKAMOTO]] (1 collaborations)
* [[:Category:Ryuichi OIKAWA|Ryuichi OIKAWA]][[Category:Ryuichi OIKAWA]] (1 collaborations)

[[Category:Shuuichi KARIYAZAKI]]
[[Category:Inventors]]
[[Category:Inventors filing patents with Renesas Electronics Corporation]]