Category:Minglu Liu of Chandler AZ (US): Difference between revisions

Minglu Liu of Chandler AZ (US)

Executive Summary

Minglu Liu of Chandler AZ (US) is an inventor who has filed 10 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (8 patents), {Multilayer substrates (multilayer metallisation on monolayer substrate (6 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), and they have worked with companies such as Intel Corporation (10 patents). Their most frequent collaborators include (10 collaborations), (8 collaborations), (2 collaborations).

Patent Filing Activity

File:Minglu Liu of Chandler AZ (US) Monthly Patent Applications.png

Technology Areas

File:Minglu Liu of Chandler AZ (US) Top Technology Areas.png

List of Technology Areas

• H01L23/15 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 6 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 5 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 3 patents
• H01L23/49894 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 3 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/645 ({Inductive arrangements (): 2 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/295 ({containing a filler (): 2 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/24 (solid or gel at the normal operating temperature of the device {(): 1 patents
• H01L23/3675 (Cooling facilitated by shape of device {(): 1 patents
• H01L28/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49866 ({characterised by the materials (materials of the substrates): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/642 ({Capacitive arrangements (): 1 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 1 patents
• H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
• H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/117 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
• H01L29/66181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/1703 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32157 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1205 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/42 (Fillings or auxiliary members in containers {or encapsulations} selected or arranged to facilitate heating or cooling): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents

Companies

File:Minglu Liu of Chandler AZ (US) Top Companies.png

List of Companies

• Intel Corporation: 10 patents

Collaborators

• Gang Duan of Chandler AZ (US) (10 collaborations)
• Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US) (8 collaborations)
• Yosuke Kanaoka of Chandler AZ (US) (2 collaborations)
• Srinivas V. Pietambaram of Chandler AZ (US) (2 collaborations)
• Brandon C. Marin of Gilbert AZ (US) (2 collaborations)
• Bohan Shan of Chandler AZ (US) (2 collaborations)
• Haobo Chen of Chandler AZ (US) (2 collaborations)
• Jeremy Ecton of Gilbert AZ (US) (2 collaborations)
• Benjamin T. Duong of Phoenix AZ (US) (2 collaborations)
• Suddhasattwa Nad of Chandler AZ (US) (2 collaborations)
• Ibrahim El Khatib of Chandler AZ (US) (1 collaborations)
• Jesse Cole Jones of Chandler AZ (US) (1 collaborations)
• Yi Li of Chandler AZ (US) (1 collaborations)
• Robin Shea McRee of Chandler AZ (US) (1 collaborations)
• Praveen Sreeramagiri of Gilbert AZ (US) (1 collaborations)