Category:Yee-Chia Yeo: Difference between revisions

Latest revision as of 04:11, 30 March 2025

Yee-Chia Yeo

Executive Summary

Yee-Chia Yeo is an inventor who has filed 6 patents. Their primary areas of innovation include No explanation available (3 patents), No explanation available (3 patents), No explanation available (3 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (6 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Yee-Chia Yeo Monthly Patent Applications.png

Technology Areas

File:Yee-Chia Yeo Top Technology Areas.png

List of Technology Areas

H10D30/024 (No explanation available): 3 patents
H10D30/6211 (No explanation available): 3 patents
H10D84/038 (No explanation available): 3 patents
H10D30/6219 (No explanation available): 2 patents
H10D84/017 (No explanation available): 2 patents
H10D84/0193 (No explanation available): 2 patents
H10D84/853 (No explanation available): 2 patents
H01L21/02532 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
H01L21/823821 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
H01L27/0886 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L27/0924 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
H01L21/28518 (from a gas or vapour, e.g. condensation): 1 patents
H01L21/31111 ({by chemical means}): 1 patents
H01L21/32133 ({by chemical means only}): 1 patents
H01L21/3215 (Doping the layers): 1 patents
H01L21/76805 ({the opening being a via or contact hole penetrating the underlying conductor}): 1 patents
H01L21/76829 ({characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers}): 1 patents
H01L21/7684 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
H01L21/76892 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
H01L23/53257 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
H10D62/151 (No explanation available): 1 patents
H10D64/62 (No explanation available): 1 patents
H10D64/01 (No explanation available): 1 patents
H10D64/258 (No explanation available): 1 patents
H10D84/0186 (No explanation available): 1 patents
H01L21/30604 (Chemical or electrical treatment, e.g. electrolytic etching (to form insulating layers): 1 patents
H10D84/0188 (No explanation available): 1 patents
H01L21/02667 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H10D62/299 (No explanation available): 1 patents
H10D30/6713 (No explanation available): 1 patents
H01L21/0259 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H10D30/031 (No explanation available): 1 patents
H10D30/6735 (No explanation available): 1 patents
H10D30/6757 (No explanation available): 1 patents
H10D30/797 (No explanation available): 1 patents
H10D62/021 (No explanation available): 1 patents
H10D62/118 (No explanation available): 1 patents
H10D64/018 (No explanation available): 1 patents
H10D84/0167 (No explanation available): 1 patents
H10D84/0184 (No explanation available): 1 patents
H10D84/85 (No explanation available): 1 patents

Companies

File:Yee-Chia Yeo Top Companies.png

List of Companies

Taiwan Semiconductor Manufacturing Co., Ltd.: 6 patents

Collaborators

Pei-Ren Jeng (2 collaborations)
Meng-Han Chou (2 collaborations)
Su-Hao Liu (2 collaborations)
Huicheng Chang (2 collaborations)
Ta-Chun Ma (2 collaborations)
Hung-Yao Chen (1 collaborations)
Pin-Chu Liang (1 collaborations)
Hsueh-Chang Sung (1 collaborations)
Kuo-Ju Chen (1 collaborations)
Liang-Yin Chen (1 collaborations)
Yi-Syuan Siao (1 collaborations)
Yi-Cheng Li (1 collaborations)
Pin-Ju Liang (1 collaborations)
Yan-Ting Lin (1 collaborations)
Yen-Ru Lee (1 collaborations)
Chien-Chang Su (1 collaborations)
Chih-Yun Chin (1 collaborations)
Chien-Wei Lee (1 collaborations)
Pang-Yen Tsai (1 collaborations)
Chii-Horng Li (1 collaborations)

Subcategories

This category has the following 2 subcategories, out of 2 total.

H

► Huicheng Chang‎ (2 C)

Y

► Yee-Chia Yeo‎ (2 C)

@@ Line 2: / Line 2: @@
 === Executive Summary ===
-Yee-Chia Yeo is an inventor who has filed 12 patents. Their primary areas of innovation include to produce devices, e.g. integrated circuits, each consisting of a plurality of components (5 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (12 patents). Their most frequent collaborators include [[Category:Huicheng Chang|Huicheng Chang]] (10 collaborations), [[Category:Liang-Yin Chen|Liang-Yin Chen]] (5 collaborations), [[Category:Su-Hao Liu|Su-Hao Liu]] (3 collaborations).
+Yee-Chia Yeo is an inventor who has filed 6 patents. Their primary areas of innovation include No explanation available (3 patents), No explanation available (3 patents), No explanation available (3 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (6 patents). Their most frequent collaborators include [[Category:Pei-Ren Jeng|Pei-Ren Jeng]] (2 collaborations), [[Category:Meng-Han Chou|Meng-Han Chou]] (2 collaborations), [[Category:Su-Hao Liu|Su-Hao Liu]] (2 collaborations).
 === Patent Filing Activity ===
@@ Line 11: / Line 11: @@
 ==== List of Technology Areas ====
-* [[:Category:CPC_H01L21/823431|H01L21/823431]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 5 patents
+* [[:Category:CPC_H10D30/024|H10D30/024]] (No explanation available): 3 patents
-* [[:Category:CPC_H01L21/823821|H01L21/823821]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 4 patents
+* [[:Category:CPC_H10D30/6211|H10D30/6211]] (No explanation available): 3 patents
-* [[:Category:CPC_H01L27/0924|H01L27/0924]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H10D84/038|H10D84/038]] (No explanation available): 3 patents
-* [[:Category:CPC_H01L29/66545|H01L29/66545]] ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 4 patents
+* [[:Category:CPC_H10D30/6219|H10D30/6219]] (No explanation available): 2 patents
-* [[:Category:CPC_H01L29/7851|H01L29/7851]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H10D84/017|H10D84/017]] (No explanation available): 2 patents
-* [[:Category:CPC_H01L29/66795|H01L29/66795]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H10D84/0193|H10D84/0193]] (No explanation available): 2 patents
-* [[:Category:CPC_H01L29/785|H01L29/785]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H10D84/853|H10D84/853]] (No explanation available): 2 patents
-* [[:Category:CPC_H01L21/28518|H01L21/28518]] (from a gas or vapour, e.g. condensation): 3 patents
+* [[:Category:CPC_H01L21/02532|H01L21/02532]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 2 patents
+* [[:Category:CPC_H01L21/823431|H01L21/823431]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
-* [[:Category:CPC_H01L21/823807|H01L21/823807]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
+* [[:Category:CPC_H01L21/823821|H01L21/823821]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
-* [[:Category:CPC_H01L21/266|H01L21/266]] (using masks {(): 2 patents
-* [[:Category:CPC_H01L21/823481|H01L21/823481]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
-* [[:Category:CPC_H01L29/0649|H01L29/0649]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L29/42392|H01L29/42392]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L29/775|H01L29/775]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L21/31155|H01L21/31155]] (Doping the insulating layers): 2 patents
-* [[:Category:CPC_H01L21/823828|H01L21/823828]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
-* [[:Category:CPC_H01L29/0847|H01L29/0847]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
-* [[:Category:CPC_H01L21/823418|H01L21/823418]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
-* [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/265|H01L21/265]] (producing ion implantation): 1 patents
-* [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 1 patents
-* [[:Category:CPC_H01L21/7806|H01L21/7806]] ({involving the separation of the active layers from a substrate}): 1 patents
-* [[:Category:CPC_H01L21/823892|H01L21/823892]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
-* [[:Category:CPC_H01L27/0928|H01L27/0928]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/76229|H01L21/76229]] (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
 * [[:Category:CPC_H01L27/0886|H01L27/0886]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/823412|H01L21/823412]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
+* [[:Category:CPC_H01L27/0924|H01L27/0924]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/0669|H01L29/0669]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/76895|H01L21/76895]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
-* [[:Category:CPC_H01L29/66553|H01L29/66553]] ({using self aligned silicidation, i.e. salicide  (formation of conductive layers comprising silicides): 1 patents
+* [[:Category:CPC_H01L21/28518|H01L21/28518]] (from a gas or vapour, e.g. condensation): 1 patents
-* [[:Category:CPC_H01L29/78696|H01L29/78696]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L21/31111|H01L21/31111]] ({by chemical means}): 1 patents
-* [[:Category:CPC_H01L21/764|H01L21/764]] (Making of isolation regions between components): 1 patents
+* [[:Category:CPC_H01L21/32133|H01L21/32133]] ({by chemical means only}): 1 patents
-* [[:Category:CPC_H01L21/7682|H01L21/7682]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
+* [[:Category:CPC_H01L21/3215|H01L21/3215]] (Doping the layers): 1 patents
-* [[:Category:CPC_H01L21/76825|H01L21/76825]] ({by exposing the layer to particle radiation, e.g. ion implantation, irradiation with UV light or electrons etc.  (plasma treatment): 1 patents
+* [[:Category:CPC_H01L21/76805|H01L21/76805]] ({the opening being a via or contact hole penetrating the underlying conductor}): 1 patents
-* [[:Category:CPC_H01L21/76831|H01L21/76831]] ({in via holes or trenches, e.g. non-conductive sidewall liners}): 1 patents
+* [[:Category:CPC_H01L21/76829|H01L21/76829]] ({characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers}): 1 patents
-* [[:Category:CPC_H01L21/76897|H01L21/76897]] ({Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step  (self-aligned silicidation on field effect transistors): 1 patents
+* [[:Category:CPC_H01L21/7684|H01L21/7684]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
-* [[:Category:CPC_H01L21/823864|H01L21/823864]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
+* [[:Category:CPC_H01L21/76892|H01L21/76892]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
-* [[:Category:CPC_H01L21/823871|H01L21/823871]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
+* [[:Category:CPC_H01L23/53257|H01L23/53257]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/41725|H01L29/41725]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H01L23/535|H01L23/535]] (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
-* [[:Category:CPC_H01L29/41766|H01L29/41766]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H10D62/151|H10D62/151]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L29/41791|H01L29/41791]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H10D64/62|H10D64/62]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L29/4991|H01L29/4991]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H10D64/01|H10D64/01]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L29/6653|H01L29/6653]] ({using self aligned silicidation, i.e. salicide  (formation of conductive layers comprising silicides): 1 patents
+* [[:Category:CPC_H10D64/258|H10D64/258]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/823468|H01L21/823468]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
+* [[:Category:CPC_H10D84/0186|H10D84/0186]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/681|H01L21/681]] (for positioning, orientation or alignment): 1 patents
+* [[:Category:CPC_H01L21/30604|H01L21/30604]] (Chemical or electrical treatment, e.g. electrolytic etching  (to form insulating layers): 1 patents
-* [[:Category:CPC_G06T1/0014|G06T1/0014]] ({Image feed-back for automatic industrial control, e.g. robot with camera  (robots): 1 patents
+* [[:Category:CPC_H10D84/0188|H10D84/0188]] (No explanation available): 1 patents
-* [[:Category:CPC_G06T7/0004|G06T7/0004]] ({Industrial image inspection}): 1 patents
+* [[:Category:CPC_H01L21/02667|H01L21/02667]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_G06T7/73|G06T7/73]] (using feature-based methods): 1 patents
+* [[:Category:CPC_H10D62/299|H10D62/299]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L23/544|H01L23/544]] (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps  (test patterns for characterising or monitoring manufacturing processes): 1 patents
+* [[:Category:CPC_H10D30/6713|H10D30/6713]] (No explanation available): 1 patents
-* [[:Category:CPC_G06T2207/30148|G06T2207/30148]] (Subject of image; Context of image processing): 1 patents
+* [[:Category:CPC_H01L21/0259|H01L21/0259]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2223/54493|H01L2223/54493]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H10D30/031|H10D30/031]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L29/401|H01L29/401]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H10D30/6735|H10D30/6735]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/0337|H01L21/0337]] ({characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment}): 1 patents
+* [[:Category:CPC_H10D30/6757|H10D30/6757]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L29/456|H01L29/456]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H10D30/797|H10D30/797]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/02532|H01L21/02532]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H10D62/021|H10D62/021]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/26506|H01L21/26506]] (producing ion implantation): 1 patents
+* [[:Category:CPC_H10D62/118|H10D62/118]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/324|H01L21/324]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H10D64/018|H10D64/018]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/76814|H01L21/76814]] ({post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors}): 1 patents
+* [[:Category:CPC_H10D84/0167|H10D84/0167]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L21/823814|H01L21/823814]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
+* [[:Category:CPC_H10D84/0184|H10D84/0184]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L29/161|H01L29/161]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_H10D84/85|H10D84/85]] (No explanation available): 1 patents
-* [[:Category:CPC_H01L29/66507|H01L29/66507]] ({providing different silicide thicknesses on the gate and on source or drain}): 1 patents
-* [[:Category:CPC_H01L29/7845|H01L29/7845]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/7848|H01L29/7848]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L2029/7858|H01L2029/7858]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L21/561|H01L21/561]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L25/0652|H01L25/0652]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/66439|H01L29/66439]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H01L29/0673|H01L29/0673]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 === Companies ===
@@ Line 85: / Line 60: @@
 ==== List of Companies ====
-* Taiwan Semiconductor Manufacturing Co., Ltd.: 12 patents
+* Taiwan Semiconductor Manufacturing Co., Ltd.: 6 patents
 === Collaborators ===
-* [[:Category:Huicheng Chang|Huicheng Chang]][[Category:Huicheng Chang]] (10 collaborations)
+* [[:Category:Pei-Ren Jeng|Pei-Ren Jeng]][[Category:Pei-Ren Jeng]] (2 collaborations)
-* [[:Category:Liang-Yin Chen|Liang-Yin Chen]][[Category:Liang-Yin Chen]] (5 collaborations)
+* [[:Category:Meng-Han Chou|Meng-Han Chou]][[Category:Meng-Han Chou]] (2 collaborations)
-* [[:Category:Su-Hao Liu|Su-Hao Liu]][[Category:Su-Hao Liu]] (3 collaborations)
+* [[:Category:Su-Hao Liu|Su-Hao Liu]][[Category:Su-Hao Liu]] (2 collaborations)
-* [[:Category:Jyh-Cherng Sheu|Jyh-Cherng Sheu]][[Category:Jyh-Cherng Sheu]] (2 collaborations)
+* [[:Category:Huicheng Chang|Huicheng Chang]][[Category:Huicheng Chang]] (2 collaborations)
-* [[:Category:Chen-Fong Tsai|Chen-Fong Tsai]][[Category:Chen-Fong Tsai]] (2 collaborations)
+* [[:Category:Ta-Chun Ma|Ta-Chun Ma]][[Category:Ta-Chun Ma]] (2 collaborations)
-* [[:Category:Yun Chen Teng|Yun Chen Teng]][[Category:Yun Chen Teng]] (2 collaborations)
+* [[:Category:Hung-Yao Chen|Hung-Yao Chen]][[Category:Hung-Yao Chen]] (1 collaborations)
-* [[:Category:Han-De Chen|Han-De Chen]][[Category:Han-De Chen]] (2 collaborations)
+* [[:Category:Pin-Chu Liang|Pin-Chu Liang]][[Category:Pin-Chu Liang]] (1 collaborations)
-* [[:Category:Wen-Yen Chen|Wen-Yen Chen]][[Category:Wen-Yen Chen]] (2 collaborations)
+* [[:Category:Hsueh-Chang Sung|Hsueh-Chang Sung]][[Category:Hsueh-Chang Sung]] (1 collaborations)
-* [[:Category:Tsai-Yu Huang|Tsai-Yu Huang]][[Category:Tsai-Yu Huang]] (2 collaborations)
-* [[:Category:Jhih-Yong Han|Jhih-Yong Han]][[Category:Jhih-Yong Han]] (1 collaborations)
-* [[:Category:Yi-Ting Wu|Yi-Ting Wu]][[Category:Yi-Ting Wu]] (1 collaborations)
-* [[:Category:Szu-Ying Chen|Szu-Ying Chen]][[Category:Szu-Ying Chen]] (1 collaborations)
-* [[:Category:Sen-Hong Syue|Sen-Hong Syue]][[Category:Sen-Hong Syue]] (1 collaborations)
-* [[:Category:Yu-Chang Lin|Yu-Chang Lin]][[Category:Yu-Chang Lin]] (1 collaborations)
-* [[:Category:Chun-Feng Nieh|Chun-Feng Nieh]][[Category:Chun-Feng Nieh]] (1 collaborations)
 * [[:Category:Kuo-Ju Chen|Kuo-Ju Chen]][[Category:Kuo-Ju Chen]] (1 collaborations)
-* [[:Category:Kai-Hsuan Lee|Kai-Hsuan Lee]][[Category:Kai-Hsuan Lee]] (1 collaborations)
+* [[:Category:Liang-Yin Chen|Liang-Yin Chen]][[Category:Liang-Yin Chen]] (1 collaborations)
-* [[:Category:I-Hsieh Wong|I-Hsieh Wong]][[Category:I-Hsieh Wong]] (1 collaborations)
+* [[:Category:Yi-Syuan Siao|Yi-Syuan Siao]][[Category:Yi-Syuan Siao]] (1 collaborations)
-* [[:Category:Cheng-Yu Yang|Cheng-Yu Yang]][[Category:Cheng-Yu Yang]] (1 collaborations)
+* [[:Category:Yi-Cheng Li|Yi-Cheng Li]][[Category:Yi-Cheng Li]] (1 collaborations)
-* [[:Category:Syun-Ming Jang|Syun-Ming Jang]][[Category:Syun-Ming Jang]] (1 collaborations)
+* [[:Category:Pin-Ju Liang|Pin-Ju Liang]][[Category:Pin-Ju Liang]] (1 collaborations)
-* [[:Category:Meng-Han Chou|Meng-Han Chou]][[Category:Meng-Han Chou]] (1 collaborations)
+* [[:Category:Yan-Ting Lin|Yan-Ting Lin]][[Category:Yan-Ting Lin]] (1 collaborations)
-* [[:Category:Chih-Yun Chin|Chih-Yun Chin]][[Category:Chih-Yun Chin]] (1 collaborations)
 * [[:Category:Yen-Ru Lee|Yen-Ru Lee]][[Category:Yen-Ru Lee]] (1 collaborations)
 * [[:Category:Chien-Chang Su|Chien-Chang Su]][[Category:Chien-Chang Su]] (1 collaborations)
-* [[:Category:Yan-Ting Lin|Yan-Ting Lin]][[Category:Yan-Ting Lin]] (1 collaborations)
+* [[:Category:Chih-Yun Chin|Chih-Yun Chin]][[Category:Chih-Yun Chin]] (1 collaborations)
 * [[:Category:Chien-Wei Lee|Chien-Wei Lee]][[Category:Chien-Wei Lee]] (1 collaborations)
-* [[:Category:Bang-Ting Yan|Bang-Ting Yan]][[Category:Bang-Ting Yan]] (1 collaborations)
+* [[:Category:Pang-Yen Tsai|Pang-Yen Tsai]][[Category:Pang-Yen Tsai]] (1 collaborations)
-* [[:Category:Heng-Wen Ting|Heng-Wen Ting]][[Category:Heng-Wen Ting]] (1 collaborations)
 * [[:Category:Chii-Horng Li|Chii-Horng Li]][[Category:Chii-Horng Li]] (1 collaborations)
-* [[:Category:Chia-Cheng Chen|Chia-Cheng Chen]][[Category:Chia-Cheng Chen]] (1 collaborations)
-* [[:Category:Chih-Kai Yang|Chih-Kai Yang]][[Category:Chih-Kai Yang]] (1 collaborations)
-* [[:Category:Po-Kang Ho|Po-Kang Ho]][[Category:Po-Kang Ho]] (1 collaborations)
-* [[:Category:Tsan-Chun Wang|Tsan-Chun Wang]][[Category:Tsan-Chun Wang]] (1 collaborations)
-* [[:Category:Li-Heng Chen|Li-Heng Chen]][[Category:Li-Heng Chen]] (1 collaborations)
-* [[:Category:Li-Ting Wang|Li-Ting Wang]][[Category:Li-Ting Wang]] (1 collaborations)
-* [[:Category:Ying-Lang Wang|Ying-Lang Wang]][[Category:Ying-Lang Wang]] (1 collaborations)
-* [[:Category:Wei-Ting Chien|Wei-Ting Chien]][[Category:Wei-Ting Chien]] (1 collaborations)
 [[Category:Yee-Chia Yeo]]
 [[Category:Inventors]]
 [[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Co., Ltd.]]